Comprehensive services that deliver product innovation and program success.

Our end-to end service capabilities

Tracewell’s broad range of services are provided within a tightly integrated process that enables end-to-end control of all aspects of systems development and deployment—from technology briefings and solutioning workshops all the way through deployment and technology refresh. This process delivers the fastest path from concept to deployment and provides the services and support required to ensure mission and program success.


  • Discover the latest commercial technologies
  • Collaborate with experts to re-engineer technologies into new form factors.
  • Concept and test new ideas that solve the most challenging computing problems

& Engineering

  • Commercial technology selection
  • Platform assessment & selection
  • Solution design
  • Form factor design
  • Prototype development
  • Future platform flexibility needs assessment


  • Controlled in-house manufacturing process
  • Assembly services
  • Integration & configuration services
    • Components
    • Sub-system assemblies
    • Integrated system solutions
  • Solution compliance testing & qualification services


  • System troubleshooting
  • Development, installation and deployment support
  • Technology upgrades and product refurbishment support
  • Aftermarket and spare part support

Technology Refresh
& End-of-Life

  • Roadmap and strategy for pre-planned technology refreshes
  • End-of-life technology management

Program and Product Management

Our Advanced Form Factor Engineering™ Process

Our Advanced Form Factor Engineering™ process is a product of our 40 year history and defines how we transform commercial technologies into form factors that meet a variety of mission environments.

Commercial Technology Selection

We strategically select proven technologies that deliver:

  • High-performance
  • Best-in-class
  • Disruptive characteristics
  • Long-term roadmap

Design &


  • Solution visualization
  • Solution optimization
  • Consider critical environmental factors:
    • Power
    • Cooling
    • Shock and vibration
    • Condensation
  • Design for future platform flexibility and longevity


Collaboration across engineering disciplines:

  • Electrical
  • Mechanical
  • Thermal
  • Interconnect
  • EMI shielding
  • Test requirements


Create production ready computing solutions in new form factors that are:

  • Rugged
  • Small
  • Modular
  • Serviceable
  • Light weight
  • Technology refresh capable
  • Correct platform interface

Manufacturing & Integration