Avoiding the Domino Effect
In many companies, typical concept cycles follow a top-down design approach. They begin by defining what the end product needs to be in order to support the application. The various elements of the design include processing power, I/O, operating system, backplane, power, size, weight, operating conditions, thermals, serviceability, etc. After requirements are determined, subject matter experts attempt the various elements as individual challenges.
Electrical Engineers evaluate backplane, wiring, I/O and COTS versus custom design. Mechanical Engineers review structure, environmental, thermals, airflow, weight and size and materials. Power Engineers review off-the-shelf solutions, AC/DC requirements, custom solutions, etc. and so on.
By the time the cascade of engineered solutions is complete, the system is less than optimized from the original vision. The system may work well within a lab environment, but it is typically over budget, has too many or redundant parts, is overweight and not likely to survive the target environment. This is the “Domino Effect,” where small changes lead to more changes like dominos falling in a row.
At Tracewell, we take a universal approach to the problem. We put all known requirements and hardware on the table. Subject matter engineering experts — mechanical, electrical, power, thermal and software — collaborate on the project.
We begin by looking at the commonality of parts and electronics as an exercise to reduce or combine components. Shared and independent power requirements across electronics are studied to minimize the amount of power sources, which typically reduces weight and heat load. Environmental concerns are reviewed in conjunction with material structure; thermal management is determined. Serviceability and upgradeability are key to the design process. And, of course, total cost of ownership and operating cost are critical.
Once we work through the bottom-up technology spiral, we know exactly what boards or components are trouble spots. The design exercise puts these elements in advantageous locations to leverage cooling opportunities. Thermal solutions validations begin early in the conceptual design cycle. The solution is modular with thought given to potential future design paths that might include thermal retrofit kits to change, for instance, from air-to-air to liquid cold plates, or TECs. This protects the customer’s investment as technology evolves and thermal concerns increase.
The end result? A simpler, smaller, lighter design that’s more reliable, serviceable and upgradeable—and, most importantly, a product that exceeds customers’ original requirements and expectations.
